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Mini DC Feedthrus Solve Cracking Problems

For many high frequency designers building custom assemblies, maintaining tight pitch (<0.100") between feedthrus is critical to layout and performance issues. The drawback of this tight pitch is that it sometimes results in excessive stress on the glass seal because of thermal expansion. With sufficient unrestrained expansion, the glass seal may crack within the body of the feedthru requiring removal and rework. A single feedthru failure in a tight pitch row often requires the removal of adjacent feedthrus in the row. Thunderline-Z has solved this problem with the development of a miniature hermetic glass feedthru with a body height that is just 0.035". This is a size reduction of approximately 13% from an average feedthru body used in these applications. This compact body allows the glass seal to be recessed into the housing while maintaining the same wall thickness and hole configuration thereby eliminating the excessive thermal stress on the glass seal. The redesigned feedthru promotes a more robust seal in "problem housings" where housings have already been machined and require the same hole-configuration and wall thickness as the standard feedthru. An additional benefit is that these feedthrus allow for a solder schedule of up to 290° C. This high temperature rating increases solder schedule flexibility across the whole module and helps to reduce final inspection time. The updated feedthrus are ideal for a variety of applications where maintaining tight spacing between feedthrus is critical. And are in use today in Thunderline-Z's SolderTight custom packages.

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