Thunderline-Z Features

Advanced Soldering Solution Speeds Up Assembly, Increases Performance in Multi-Termination Packages To satisfy the needs of component and subsystem manufacturers required to adhere to repeatable soldering schedules in multi-termination packages, Thunderline-Z has developed an advanced process for producing premium packages. The process utilizes advanced furnace profiling techniques combined with a variety of solder materials and soldering techniques. The result is the ability to quickly deliver packages with any combination and number of the following termination types: Capacitive feedthrus; GPOTM/GPPOTM Connectors; RF and DC feedthrus; HF probes; and Grounding Pins. Frequencies of up to 65 GHz are achievable with hermeticity being offered at up to 1 x E(-9) cc/sec @ 1atm. Thunderline-Z has developed this advancement in soldered assembly packaging in response to the requirements of component and subsystem manufacturers needing to include everything from grounding planes to 65 GHz terminations in a single package. Prior to this development, engineers were left to cope with ways to ensure high temperature sealing while maintaining low temperature soldering on their own. This was previously accomplished by independently addressing each termination, sometimes with a hot plate, or numerous and costly passes through a furnace and then into and out of test departments. In addition to the inherent labor costs, this practice proved difficult to work with on the component installation end, as the consistency of the process was difficult to repeat. Thunderline-Z's advanced packages are ideal for circuit designers in the RF, Microwave, Medical, and Telecom industries requiring repeatable, high performance seals and connections in their multi-termination packages.