Hybrid and Microcircuit Modules

Your Hybrid Package, Our Feedthrus If staying competitive in today's marketplace means delivering faster, and never having to say you're sorry, look to Thunderline-Z for your complete Hybrid and Microcircuit packaging requirements. With so much more on your plate in regards to engineering circuits, rely on Thunderline-Z to provide the Kovar housings and hermetic connectors to package them with. Standard outline packages include TO and DIP configurations. These packages give you the ability to offer your customer a device which can be easily plugged into a socket or printed circuit board. Custom pin layouts, ground pins, RF pins, and standoffs are all common options for these designs. Flatpack/Surface Mount... Thunderline-Z has supplied thousands of this popular design for space saving circuit applications. The package bodies are available in brazed, coined or machined construction. Material selections include Kovar, Cold Rolled Steel, Stainless Steel, Composites and combinations thereof. Plug-ins... These packages tend to be utilized by circuit engineers who want the cost and plug-in advantages of standard outlines but need special sizes and lead configurations. Thunderline-Z has the advantage of being able to obtain or custom engineer the basic package and add pins of the type and position to suit a customer's needs. This capability also gives Thunderline-Z the ability to respond quickly and to offer the unusual options that are often necessary for these applications.