If you're struggling with production
constraints, quality issues or a limited time
frame in which to complete your RF/Microwave Hybrid or micro circuit packages, turn to
Thunderline-Z. In addition to providing the world's most popular
feedthrus over the last three decades, we have also delivered over
1,000,000 custom hermetic packages.
Our state-of-the art facility
employs multi-atmosphere and multi-zone temperature control furnaces. Our
experience encompasses the broadest range of soldering technology in
the microwave business. You can trust our industry trained engineering
team to provide turnkey packages with any
combination of feedthrus, press on connectors or multi-pin headers.
Solder Tight Technology blends Thunderline-Z's years of experience with proprietary
soldering oven profiling techniques to create premium packages. From basic tin base
soldering to gold/tin solders for applications that demand higher strength and longevity,
we have the extensive experience and controlled manufacturing processes to deliver
exceptional quality. You will prefer your packages Solder Tight because they are truly hermetic. They are also
easily affordable and delivered to your schedule.
Direct Bond is Thunderline-Z's answer to the need for extremely high performance direct
sealed packages where glass is matched and sealed directly to a metal housing. While
our experience in soldering has led to premium soldered packages, our additional research
and development of tightly monitored temperature control ensures the tightest matched
direct seal packages as well. By utilizing these controls we have perfected an approach that
guarantees true hermeticity over the widest commercial temperature ranges and helps solve
high frequency power loss problems inherent in other manufacturing techniques.
Z Bond technology is used in combination with our Direct Bond packaging
solutions to add value when additional components such as ground pins,
heat sinks, pads, and exhaust tubes need to be bonded within a package.
Our extensive knowledge of stainless steel, Kovar, molybdenum,
copper and a multitude of alloys have led to this unique brazing
approach that provides flexibility for heat dissipation and
thermal transfer in package designs.
